代PO，勿站內信
月薪10萬起<美商Cisco思科校園招募>Component Engineer
限應屆畢業生或一年以內工作經驗
此"校園"招募職位，月薪為新台幣10萬元起~
台北全職(Full Time) 職缺- Component Engineer |
申請截止日：2018年4月30日 | 此次主要招募對像為材料科學，工程類碩士
( 電機工程, 材料工程, 化學工程, 機械工程, 應用科學相關工程類研究所畢業)
上班日：2018年8月
聯絡方式：投遞中英文履歷至 Cisco人力資源大中華區聯絡人 Kathy Zhang |
[email protected]| +86 21 24057072| +86 13621609284 |
工作地點地址：台灣思科系統股份有限公司（台北市信義路四段 460 號 12 樓）
電話：+8862 8758 7100
～月薪為新台幣10萬元起~
<薪資福利>
薪資: 月薪新台幣10萬元起~12個月
公司獎金：視績效與公司營運
特休假：一年16天（帶薪病假24天另計）
加班費制度：比照勞基法
<工作型態>
出差外派：需出差，一年累積時間一個月
管理責任：不需負擔管理責任
公司介紹
We’re the people who made the Internet what it is today. From its early days
of simple connectivity to the future of the Internet of Everything, we’ve
pioneered it every step of the way. Now we’re building the best team in the
business so we can continue to change the way the world works, lives, plays,
and learns by connecting the unconnected.
Exciting opportunity to join in Cisco, No 1 IT Company in its Global Supply
Management team within Supply Chain in order to help Cisco to create an
unrivaled customer experience & competitive advantage for Cisco through end
to end operations leadership and supply management.
Technology and Quality CQT Organization - Component Quality and Technology
(CQT) organization is responsible for delivering customer-driven quality and
reliability solutions and infrastructure for Cisco products. We are committed
to driving a competitive advantage for Cisco by ensuring innovation and
excellence in component technology and engineering.
思科全球供應鏈技術和質量部 - 通過製造技術革新，工程測試和零部件測試，新產品管
理，以及質量閉環管理，提供以消費者為導向的高質量，和穩定可靠的產品.
工作內容和描述Responsibilities:
As a Component Engineer in the Component Quality and Technology (CQT)
organization, you’ll manage all aspects of IC packaging technology to drive
quality and reliable solutions for Cisco products. You’ll work with next
generation technology to help improve Cisco’s competitive advantage. You’ll
work with smart people on a variety of smart projects.
Then you’ll work with your team to plan innovative solutions to bring the
future even closer.
職缺能力及經歷要求Education Eligibility Criteria :
‧ You have a Master degree in Material Science/Engineering related
‧ You possess strong program management skills
‧ You have strong leadership skills
‧ You must work well in teams
‧ You must be fluent in speaking and writing in English
‧ You must possess prior IC packaging and assembly related knowledge
(material physical, chemical, mechanical, thermal, electrical and reliability
characteristics, etc)
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