10奈米良率低...聯發科 X30出貨遭拖累 - 工程師
By Linda
at 2017-03-02T08:45
at 2017-03-02T08:45
Table of Contents
10奈米良率低...聯發科 X30出貨遭拖累
http://www.chinatimes.com/newspapers/20170301000066-260202
搭載聯發科最新款高階晶片曦力(Helio)X30的智慧手機預定今年5月問世。不過,聯發科共同營運長朱尚祖坦言,因為10奈米製程良率的問題,所以比原定時程稍微慢了一點。
法人推估,台積電與三星在10奈米製程出貨時間應相去不遠,台積電在目前良率優勢可能僅略勝三星。
聯發科X30採用台積電10奈米鰭式場效電晶體(FinFET)製程,市場普遍預估,台積電可望於3月陸續出貨採用該製程的晶圓,不過,朱尚祖27日接受媒體採訪時表示,X30晶片比原定出貨時間晚了一點,5月才可見到搭載該晶片的智慧手機問世。
朱尚祖也說,目前所有產品線上,出貨都相當順暢,包含去年下半年供貨吃緊的28奈米製程也是一樣,唯獨採10奈米製程的X30晶片,今年上半年供貨會稍微緊縮,下半年就可放量供貨。
聯發科X30雖原訂今年上半年亮相,搶攻高階晶片市場,不過市場普遍預期,原先4月就可望見到X30晶片的手機發表。法人推估,由於目前台積電良率學習曲線仍無法快速達到預定水準,因此X30晶片比原訂出貨約慢了2~4周,不過還是在聯發科內部原先預估的範圍之內。
10奈米製程不僅台積電還無法跑得順暢,恐怕連老對手三星也是一樣,高通10奈米手機晶片驍龍(Snapdragon)835於三星投片,並已經進入量產階段,不過正式出貨時間約落在今年4月。
(工商時報)
--
http://www.chinatimes.com/newspapers/20170301000066-260202
搭載聯發科最新款高階晶片曦力(Helio)X30的智慧手機預定今年5月問世。不過,聯發科共同營運長朱尚祖坦言,因為10奈米製程良率的問題,所以比原定時程稍微慢了一點。
法人推估,台積電與三星在10奈米製程出貨時間應相去不遠,台積電在目前良率優勢可能僅略勝三星。
聯發科X30採用台積電10奈米鰭式場效電晶體(FinFET)製程,市場普遍預估,台積電可望於3月陸續出貨採用該製程的晶圓,不過,朱尚祖27日接受媒體採訪時表示,X30晶片比原定出貨時間晚了一點,5月才可見到搭載該晶片的智慧手機問世。
朱尚祖也說,目前所有產品線上,出貨都相當順暢,包含去年下半年供貨吃緊的28奈米製程也是一樣,唯獨採10奈米製程的X30晶片,今年上半年供貨會稍微緊縮,下半年就可放量供貨。
聯發科X30雖原訂今年上半年亮相,搶攻高階晶片市場,不過市場普遍預期,原先4月就可望見到X30晶片的手機發表。法人推估,由於目前台積電良率學習曲線仍無法快速達到預定水準,因此X30晶片比原訂出貨約慢了2~4周,不過還是在聯發科內部原先預估的範圍之內。
10奈米製程不僅台積電還無法跑得順暢,恐怕連老對手三星也是一樣,高通10奈米手機晶片驍龍(Snapdragon)835於三星投片,並已經進入量產階段,不過正式出貨時間約落在今年4月。
(工商時報)
--
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