IC測試~ - 工程師
By Xanthe
at 2013-04-10T11:57
at 2013-04-10T11:57
Table of Contents
IC測試是IC製造流程中重要的一環，一般可分成兩個階段，其中在切割、封裝前的測試為
IC晶圓測試(Wafer Test)，其目的在針對晶片作電性功能上的測試，使IC在進入封裝前能
先行過濾出電性功能不良的晶片，以降低IC 成品的不良率，減少製造成本的耗費。而封
裝成形後的測試為IC成品測試(Final Test)，其目的在確認IC 成品的功能、速度、容忍
度、電力消耗、熱力發散等屬性是否正常，以確保IC 出貨前的品質。對IC 製造廠商而言
，測試實為一不可缺少之關鍵製程。專業的IC測試服務廠，主要係以精密之高科技機器設
備，利用測試程式模擬IC各種可能之使用環境及方法，例如在高溫、低溫、電壓不穩及電
壓偏高或偏低等惡劣環境與一般正常使用狀況下，將受測IC置於此模擬環境中，測試其工
作狀態是否在規格範圍內，以確保IC 之品質。
全文網址:
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我一直覺得這塊很重要!!!!!!!
各位前輩覺得呢?
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工程師
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