Offer請益 - 工程師
By Puput
at 2022-04-13T19:50
at 2022-04-13T19:50
Table of Contents
各位年薪300鎂的大大,小弟現任職於GG廠務的駐廠vendor,之後想朝晶圓廠或ic設計廠
發展,目前有二份offer在考慮,想請教各位前輩的建議,謝謝
1.頎邦(力行廠)
職稱:製程工程師(bumping 電鍍/蝕刻)
工時:做四休二,三個月輪調
通勤:住家裡,騎車30分鐘
薪資:(N+2k)*14 + 季獎金/分紅/輪班津貼
2.艾克爾(龍潭廠)
職稱:製程工程師(WLCSP)
工時:8.30~17.30(常態性加班到9.,可報加班)
通勤:住家裡,開車40分鐘
薪資:(N+3k)*14 + 季獎金/分紅
N皆為現職
個人在意的點:
未來發展性/部門風氣/工作環境
--
發展,目前有二份offer在考慮,想請教各位前輩的建議,謝謝
1.頎邦(力行廠)
職稱:製程工程師(bumping 電鍍/蝕刻)
工時:做四休二,三個月輪調
通勤:住家裡,騎車30分鐘
薪資:(N+2k)*14 + 季獎金/分紅/輪班津貼
2.艾克爾(龍潭廠)
職稱:製程工程師(WLCSP)
工時:8.30~17.30(常態性加班到9.,可報加班)
通勤:住家裡,開車40分鐘
薪資:(N+3k)*14 + 季獎金/分紅
N皆為現職
個人在意的點:
未來發展性/部門風氣/工作環境
--
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