WLCSP vs Bump - 工程師
By Rachel
at 2015-04-02T01:00
at 2015-04-02T01:00
Table of Contents
Bumping業界叫做晶圓凸塊,
主要是取代傳統wire bond的連接chip and PCB
大多數晶圓廠跟封裝大廠廠都能做bumping
bumping後段的封裝通常會做Flip Chip BGA/Flip Chip CSP或是WLCSP
※ 引述《Nyaowan (博美界許維恩(妞妞 汪汪))》之銘言:
: 各位好,
: 最近想到 bumping的製程就是長球在 die上
: 請問是跟wafer level CSP 一樣的意思?
: 感謝^^
--
主要是取代傳統wire bond的連接chip and PCB
大多數晶圓廠跟封裝大廠廠都能做bumping
bumping後段的封裝通常會做Flip Chip BGA/Flip Chip CSP或是WLCSP
※ 引述《Nyaowan (博美界許維恩(妞妞 汪汪))》之銘言:
: 各位好,
: 最近想到 bumping的製程就是長球在 die上
: 請問是跟wafer level CSP 一樣的意思?
: 感謝^^
--
Tags:
工程師
All Comments
By Ina
at 2015-04-02T23:46
at 2015-04-02T23:46
By Tom
at 2015-04-07T15:48
at 2015-04-07T15:48
By Gilbert
at 2015-04-08T17:46
at 2015-04-08T17:46
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