半導體封裝詢問 - 工程師
By Andrew
at 2012-12-05T00:27
at 2012-12-05T00:27
Table of Contents
最近對於半導體封裝有一些問題存在，所以來這請益:
查到的半導體封裝製程步驟:
Die Saw => Die Bomd => Cure => Plasma Cleaning => Wire Bond => Molding =>
Cure => Marking
(1)那請問Bump製程是再哪一道製程中間?
(2)另外，一般常見的IC都是由 Chip 四週做 Wire Bond
那它的Chip Bump製程是使用在哪?
(3)是只有Flip Chip才會有Chip Bump製程嗎?
--
查到的半導體封裝製程步驟:
Die Saw => Die Bomd => Cure => Plasma Cleaning => Wire Bond => Molding =>
Cure => Marking
(1)那請問Bump製程是再哪一道製程中間?
(2)另外，一般常見的IC都是由 Chip 四週做 Wire Bond
那它的Chip Bump製程是使用在哪?
(3)是只有Flip Chip才會有Chip Bump製程嗎?
--
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工程師
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at 2012-12-06T02:41
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