半導體封裝詢問 - 工程師
By Andrew
at 2012-12-05T00:27
at 2012-12-05T00:27
Table of Contents
最近對於半導體封裝有一些問題存在，所以來這請益:
查到的半導體封裝製程步驟:
Die Saw => Die Bomd => Cure => Plasma Cleaning => Wire Bond => Molding =>
Cure => Marking
(1)那請問Bump製程是再哪一道製程中間?
(2)另外，一般常見的IC都是由 Chip 四週做 Wire Bond
那它的Chip Bump製程是使用在哪?
(3)是只有Flip Chip才會有Chip Bump製程嗎?
--
查到的半導體封裝製程步驟:
Die Saw => Die Bomd => Cure => Plasma Cleaning => Wire Bond => Molding =>
Cure => Marking
(1)那請問Bump製程是再哪一道製程中間?
(2)另外，一般常見的IC都是由 Chip 四週做 Wire Bond
那它的Chip Bump製程是使用在哪?
(3)是只有Flip Chip才會有Chip Bump製程嗎?
--
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工程師
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By Liam
at 2012-12-06T02:41
at 2012-12-06T02:41
By Anthony
at 2012-12-06T16:13
at 2012-12-06T16:13
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at 2012-12-07T12:02
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at 2012-12-10T17:10
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By Necoo
at 2012-12-13T05:02
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四周打上線連接上SBT.
By Caitlin
at 2012-12-15T11:48
at 2012-12-15T11:48
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at 2012-12-16T09:40
at 2012-12-16T09:40
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at 2012-12-21T00:53
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at 2012-12-24T05:17
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at 2012-12-24T21:59
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