台GG有可能會GG嗎??? - 工程師
By Selena
at 2013-11-28T09:40
at 2013-11-28T09:40
Table of Contents
推 dos1019:製程包括dep etch cmp litho...3D列印能做到哪幾道? 11/28 08:04
樓上 跟原Po一樣書也沒讀通喔..... 半導體製程目前主流是所謂的Top-down
就是像雕刻一樣是減法 先把一整塊材料dep上去
才會有用到litho-etch 這些製程 把不要的部分減去
但是多年以前就有人提出bottom-up的製程想法
這就像堆塑用加法 直接把材料堆上去 那這樣還需要Etching這道嗎??
只是這樣製程 要製造目前那麼複雜動輒數億顆電晶體的IC
似乎還無解 光是要材料能達到self assembly 放在你想放的位置就很困難了
以前有陣子很流行用AFM原子力顯微鏡/STM掃描穿隧顯微鏡
然後去把原子一顆一顆搬運排列 例如:可以排個台灣圖案
http://www.me.tnu.edu.tw/~me022/lab/quan.files/image032.gif
這最早好像是IBM發展的技術?
http://researcher.ibm.com/researcher/files/us-flinte/stm10.jpg
不過這樣真的太慢了......
其實3D列印也不是什麼新東西 好像機械產業以前就有快速成型機
不過我不是學機械的 這就請機械高手出來講解吧
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