台積竹科Hardware Engineer - 面試
By Wallis
at 2022-01-04T10:47
at 2022-01-04T10:47
Table of Contents
職務名稱: 2022 預聘_Hardware Engineer
工作地點: 竹科
職務說明:
1. Bachelor degree and above. Major in Electronics, Electrical Engineering, Me
chanical and Automation Engineering related fields.
2. Having experience with equipment maintenance or improvement is a plus.
3. Having semiconductor processes knowledge is a plu
各位前輩打擾了,
阿肥有個朋友(只是學士)收到這個面試邀約,
網路上相關資訊好像蠻少的,
想請問有前輩能分享面試經驗或是該職缺的工作內容嗎?
謝謝各位前輩,祝大家都有40個月年終領到爆。
--
工作地點: 竹科
職務說明:
1. Bachelor degree and above. Major in Electronics, Electrical Engineering, Me
chanical and Automation Engineering related fields.
2. Having experience with equipment maintenance or improvement is a plus.
3. Having semiconductor processes knowledge is a plu
各位前輩打擾了,
阿肥有個朋友(只是學士)收到這個面試邀約,
網路上相關資訊好像蠻少的,
想請問有前輩能分享面試經驗或是該職缺的工作內容嗎?
謝謝各位前輩,祝大家都有40個月年終領到爆。
--
All Comments
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