聯發科稱天璣 9000 多核性能媲美蘋果 iPh - 工程師
By Bennie
at 2021-11-29T00:42
at 2021-11-29T00:42
Table of Contents
新聞標題: 聯發科稱天璣 9000 多核性能媲美蘋果 iPhone 13 A15 晶片,整體比驍龍 888 強 35%
據 9to5 Google 報導,聯發科為相當多的Android手機提供晶片支援,但先前該公司的高
階產品從未能與高通驍龍一拼。然而,聯發科最新的天璣 9000 可能將要扭轉這個局面。
在本週的一次活動中,聯發科發佈了天璣 9000,這是該公司迄今為止最強大的晶片。在
原始性能方面,聯發科宣稱,該晶片性能將比驍龍 888 快大約 35%,並具有 35% 的
GPU 性能提升。
https://imgur.com/XGRbU1H
天璣 9000 的架構建立在台積電 4nm 上,使用一個主頻為 3.05GHz 的 Cortex-X2 內核
,三個主頻為 2.85GHz 的 Cortex-A710 內核,以及四個主頻為 1.8GHz 的
Cortex-A510 內核,還有 Mali-G710 GPU 十核心,APU 由四個性能核心和兩個靈活核心
組成。APU 的核心用於 AI 人工智慧。
為了進一步完善晶片的功能,圖像信號處理器是一款 7 代 18 位的 Imagiq ISP,可以捕
捉 320MP 的圖像,並以 90 億像素每秒的速度傳輸資料。內建數據機晶片能夠實現 5G,
但只是 Sub-6GHz 以下的標準,而不是mm毫米波。這意味著該晶片很可能不會在美國使用
,因為美國的主要電信商都非常關注mm毫米波 5G。這款晶片還能夠支援藍牙 5.3 和
Wi-Fi 6E。
在基準測試應用程式中,聯發科表示,天璣 9000 的多核得分與蘋果 iPhone 13 的 A15
大致相當,得分超過 4000。然而,聯發科沒有透露與蘋果晶片的其他方面的比較,一般
來說,蘋果的晶片往往比其他移動晶片要強大得多。
同時,在人工智慧方面上,聯發科聲稱這款天璣 9000 晶片擊敗了Google Tensor 晶片。
從目前的情況來看,Tensor 已經表明它在行動晶片上擁有最強的人工智慧性能。然而,
聯發科聲稱,天璣 9000 AI 性能將超過 Tensor 大約 16%,超過蘋果最新晶片高達 66%
。
新聞來源: https://reurl.cc/WXQQLe
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