高通將捨三星 改投台積 - 工程師
By Kelly
at 2021-01-11T13:56
at 2021-01-11T13:56
Table of Contents
手機晶片龍頭高通發布2021年高階5G手機晶片Snapdragon 888(S888),採用三星晶圓代
工5奈米製程,由小米旗艦級5G手機小米11首發,但小米11實測數據卻顯示S888在單核及
多核運算時功耗大幅增加,執行高效能手遊時會出現降頻情況,讓業界對於三星5奈米製
程的效能功耗比不如台積電7奈米疑慮大增。
聯發科2021年加強與台積電在先進製程合作,第一季6奈米天璣1200系列5G手機晶片進入
量產,下半年將推出5奈米天璣2000系列晶片。業界預期,高通為了鞏固5G手機晶片龍頭
地位,2021年底發布的下一代高階5G手機晶片Snapdragon 895(S895)將重回台積電投片
,預計第四季採用台積電5奈米量產,初期季投片量達3萬片,並逐季拉高投片量至2022年
第二季。
高通發表採用三星5奈米製程的高階5G手機晶片S888由小米11首發,根據外電揭露的實測
數據顯示,與上代採用台積電7奈米製程的Snapdragon 865(S865)相較,S888單核及多
核運算效能提升10%,繪圖處理器提升40%,延遲表現因搭載LPDDR5而改善。
不過S888的運算功耗明顯提高,不論單核或多核的功耗均較上代S865高出32~43%,而在
執行手遊時也會出現降頻情況,約10分鐘後效能會到與上代S865相當的水準。正因為S888
功耗高,導致小米11在執行手遊的溫度明顯上升,且高於搭載S865的小米10,因此加深了
三星5奈米製程表現不如台積電7奈米疑慮。
事實上,2020年下半年至今,市場就不時傳出高通因為製程問題,有意將部份訂單轉投台
積電的消息,其中包括高通新一代5G數據機晶片X60,且業界消息指出,蘋果iPhone 13採
用的高通X60數據機晶片會採用台積電5奈米生產。
台積電Fab 18廠第三期將於第一季進入量產,屆時5奈米月產能合計達9萬片,2021年除了
蘋果擴大採用5奈米量產iPhone應用處理器及Arm架構電腦處理器,超微預期年底會完成新
一代5奈米Zen 4設計定案並量產,至於高通及聯發科的5G手機晶片會在第四季同時採用台
積電5奈米投片。法人看好台積電5奈米利用率維持接近滿載,2021年營收占比20%目標應
可順利達陣。
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