Offer 請益 - 工程師
By Tristan Cohan
at 2021-12-02T20:53
at 2021-12-02T20:53
Table of Contents
各位前輩好
因朋友沒有帳號,幫他代po,拿到以下的offer
1.力成
職位:產品工程師(晶圓級封裝)
薪資:N+9k*14+分紅+季獎金
地點:竹科
住宿:租屋
工時:大概七點多下班,有case就會忙晚一點
2.美光
職位:HBM/3Di CEM 封裝工程師
薪資:N+9*14+分紅
地點:后里
住宿:住宿舍/租屋
工時:不確定,但不用輪班
考慮到未來發展性與穩定性,希望大家可以幫忙提供他一些建議
感謝各位!
--
因朋友沒有帳號,幫他代po,拿到以下的offer
1.力成
職位:產品工程師(晶圓級封裝)
薪資:N+9k*14+分紅+季獎金
地點:竹科
住宿:租屋
工時:大概七點多下班,有case就會忙晚一點
2.美光
職位:HBM/3Di CEM 封裝工程師
薪資:N+9*14+分紅
地點:后里
住宿:住宿舍/租屋
工時:不確定,但不用輪班
考慮到未來發展性與穩定性,希望大家可以幫忙提供他一些建議
感謝各位!
--
Tags:
工程師
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