各段製程的前景如何? - 面試
By Hedy
at 2016-04-18T19:51
at 2016-04-18T19:51
Table of Contents
版上各位前輩好
前些日子到處奔波面試
結果最近收到了不少offer
其中有晶圓生產供應商、晶圓代工(蝕刻)、封裝(bumping)
各種不同製程的公司
若先不考慮公司 單純就各段製程的前景來說
在台灣 或是之後如果有機會可以轉外商的話
哪一段會比較有利?
或者哪一段的出路比較廣呢?
由於還沒有工作經驗 實在是不太知道現在的環境如何
還煩請各位前輩不吝賜教
小弟過段時間再把面試心得PO上來回饋版眾
謝謝各位
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