請問有版友在美國當製程整合工程師嗎? - 面試

請問有版友在美國當半導體製程整合工程師嗎?

因為第一個電話面試, 對方主管說從我的RESUME看不到我以前作了甚麼

想請有相關經驗的版友給我一些建議


我本身在台灣有五年工作經驗
跟面試的公司是正相關

我履歷上兩個工作經驗, 都各自寫上兩句話
寫出重要的成就(成功開發了甚麼產品, 跟提升多少良率)
跟主要負責的工作內容的科技 (eg 0.18um製程跟產品類型)

下面再列出細項, 列出主要會的工作技能
例如: CP分析, 良率提升.....etc

履歷是只有寫一頁, 就重點條列
自己以為這樣寫得很清楚

但今天電話面試完, 開始懷疑履歷是不是寫太差了 >///<

有點不確定的地方是
我是否需要把我開發產品過程中, 所遇到的問題, 如何解決都一一寫出來嗎??
到底需要詳細到甚麼程度呢?
我本以為是寫出達成目標
然後面試中再跟對方口頭解釋怎麼達到目標即可,
但這樣會太簡略嗎??


沒想到第一個面試就是我的dream job,
連練習interview的機會都沒有就趕鴨子上架
真的很希望能好好把握這個機會

謝謝大家, 有任何建議歡迎各位指導
感激不盡 & 新年快樂


這邊也貼上我的履歷給大家參考, 看我應該如何改進會比較好, 謝謝

Highly analytical and work efficient engineer with 5 years of process
integration and development experience in semiconductor industry.


Work experience

XXXXXXXXXXXXXXXXXXXX, Hsinchu, Taiwan Oct., 2010~ Dec., 2011
Senior Foundry Engineer/ R&D Center/ Pixel Design Department

- Successfully improve yield from 30~50% to 80% by ion implantation split
experiment.
- Performed R&D and successfully produced 0.13um, 0.11um, 90nm process, 8
inch wafer CIS product.
- Main responsibilities include new product/ technology development and
transfer to mass production.
‧ CP analysis
‧ Yield improvement (RD to Production stage)
‧ Process integration
‧ Liaison between designer and foundry fab
‧ Design experiment to improve product performance
‧ New FAB product and process development

XXXXXXXXXXXXXXXXXXXXXX, Hsinchu, Taiwan Dec., 2006~ Apr.,2010
Senior Process Integration Engineer/Special Technology Division/ CMOS Image
Sensor Department

- Ramp up CIS product from development stage to mass production, produced
yield improvement from 0~20% to 70%.
- Main responsibilities include new product development and assist mass
production.
- Responsible for development of Backside illumination (BSI) CIS (new
product).
‧ Patent research
‧ Process flow set-up/experiment design
‧ New process vendor and apparatus survey
‧ Trouble shooting/problem analysis


Job Skills

‧ CP analysis/ Yield enhancement
‧ FEOL/ BEOL/ CFA process improvement
‧ Troubleshooting/ data & root cause analysis
‧ Communicate with cross function engineers
‧ Product management
‧ Semiconductor process integration
‧ Knowledge of TCAD simulation
‧ Knowledge of characterization/ package/ Final Test


Education

XXXXXXXXXXXXXXXXX, Taipei, Taiwan Aug., 2004~ July, 2006
Master degree/ Materials Science and Engineering/ Optoelectronic Thin-Film
Processing Lab

- Successfully deposited an Al2O3 inorganic layer by atomic layer deposition
(ALD) on polyimide (PI) substrates to achieve the requirement of OLED’s,
10-3 c.c./m2．day of OTR.
- Developed a simple, yet sensitive, permeation measurement method based on
helium permeation to evaluate the thin film barrier properties. (Patent
applied)

XXXXXXXXXXXXXXXXX, Taipei, Taiwan Aug.,2000~ July, 2002
BS degree/ Chemical Engineering


Language

‧ Chinese/ Mandarin Write/Read/ Speak/ Listen Native language
‧ English Write/Read/ Speak/ Listen Fluent

















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