Intel 3D/Video/Graphics Software Engineer - 履歷

先來貼 英文版的工作內容

Description

In this position, you will be joining the Graphics Engineering (GE)
Fulsim team responsible for hardware modeling of all graphics projects.
The Fulsim team design and develop C++ pipeline that models 3D and/or
2D graphics and Video (MPEG and/or AVC and/or VC1) and/or image enhancement
algorithms used in Intel's chips. You will be working on
spec definition and algorithm development (along with architects,
micro-architects, and Design Engineers), and owning the software
design and validation. This model is the primary reference for
graphics and media hardware validation, both pre and post-silicon,
and it's also used by the graphics driver team for driver debug and
development.


Qualifications
You should possess a Bachelor or a Master of Science degree in
Electrical Engineering, Computer Engineering, Computer Science or a
related discipline. Additional qualifications include:
- Strong C++ coding skills with practical experience in OO programming
- Knowledge in programming and debugging in IA-32 assembly language
and Perl and/or Ruby*
- Strong written and verbal communication skills
- Good knowledge of microprocessors and computer system architecture
- Understanding of digital electronics and logic design
- Good knowledge of IA-32, PC platforms and operating systems
- Excellent communication, interpersonal and problem solving skills
- A self-starter with the ability to work effectively both
independently and in a team
- Good planning and strong problem solving skills
- Knowledge of 3D and 2D graphics algorithms or video specs would be
an added advantage, as is a good knowledge of Intel hardware
architecture


Business Group
Employees in Intel's Mobility Group design and implement the Intel
mobile technology used in notebook computers, phones, ultra-mobile
PCs and other portable devices. Intel's industry leading technology
includes processors, chipsets, Enhanced Data for GSM Environment (EDGE),
Universal Mobile Telecommunications System (UMTS), High-Speed
Downlink Packet Access (HSDPA), Wi-Fi and WiMAX wireless radios. These
industry-leading technologies are driving the new mobile era of
semiconductors, where people will carry their computing with them,
making it truly personal. This group is growing very quickly, and has
the broadest set of mobile and wireless technologies in the industry.

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接下來是 翻譯豆沙包

1. 找RCG, 有經驗者 or summer starter 想要幹掉nVidia的人 @@~
2. 工作內容: IC design front end job: Software modeling, validation, C model
(對 沒有徵VLSI engineer 也沒有RTL相關的部份)
3. 產品: INTEL Graphic Chipset 的 3D/2D/Media(Video Codec)
4. 要求: 具備以下其中一個knowledge
- 3D Graphics
- Video codec(Mpeg124, H.264, VC1)
compression algorithm(Transform/Motion search/estimation/deblocking)
5. 地點: Folsom, CA (荒涼的地方 但是可以週週開去Tahoe..XD)

PS:

1. 我不是在Intel上班的 但是我可以幫你把履歷塞進去
2. Manager親自要人 所以你的履歷會直接被送到Manager的信箱
3. 相關徵才可以在INTEL網站看到 不過上面大概只寫 需要有經驗者
4. 希望真的覺得自己qualify的人再來投履歷吧 :)
5. 請附上履歷.pdf+100字Cover letter 請寄到 [email protected]

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