力成-封裝設計工程師(記憶體封裝) - 工程師
By Edward Lewis
at 2018-09-15T11:58
at 2018-09-15T11:58
Table of Contents
科技版各位年薪三百萬的大大午安
小弟非純血四大機械碩畢業,已退伍,正在尋找第一份工作
最近有幸收到力成-封裝設計工程師(記憶體封裝)面試邀請
爬文後查不太到資訊,故想請教此公司、職務的發展性如何?
適合新鮮人練功,未來往更好的職缺發展嗎?
第一份工作,小弟比較重未來發展,薪資不是考量重點。
以及上禮拜GG設備面試完後,人資有打過來說會請主管簽核、詢問可報到日期等
自己覺得應該算是口頭offer,所以在有GG設備的前提下,以未來性而言
還有去爭取此職位的必要嗎?
請各位大大幫助對未來極度迷茫的小弟解答(不方便的話,歡迎站內信)
感謝各位!
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