OFFER請益 (聯電 vs 矽品) - 工程師
By Suhail Hany
at 2013-05-09T12:04
at 2013-05-09T12:04
Table of Contents
公司 矽品 聯電
職務 Bumping產品工程師 薄膜製程工程師
(先製程,後製程整合)
地點 台中 新竹
部門 三處一部 8F
薪水 N+3 N+5
工時 08:15~17:25 忘記問
都 要 輪 班
福利 保14?+績效獎金 保14個月+績效獎金
(主管說有、人資說不清楚)
住宿 家裡 租屋(5~7K)
交通 騎車15分鐘 租屋處騎車15分鐘
變數 主管要求先去製程磨練 無
再視情況調任製程整合
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小弟是私立淡水漁人碼頭大學化材碩畢,沒工作經驗!
退伍至今已近兩個月
前前後後面試力晶TF、矽品PIE、AUO晶材RD、勝華RD、高鼎RD、聯電TF、聯電IPQA
已推掉高鼎offer,友達晶&勝華二階段面試(薪資、發展性、公司距離),經評估後
僅留下矽品及聯電做選擇,還請望各位仙拜指點優劣迷津。
小弟有個溫暖的小康家庭,家中有屋又有田,經濟不需太擔心,但想趁年輕靠自己
工作賺來放口袋才有成就感,因擔心中年身價問題和想追求更高薪公司,所以不想剛
出社會就進發展性小的養老工作,也有中年靠儲蓄出來創業的想法(賣雞排?),目
的就是不想因中年存款不夠而把自己的路鎖死,以上為小弟的身世背景,可以砲我
但也請指點我的疑惑,拜託了,謝謝各位!
若有人想了解以上公司的面試細節,歡迎來信詢問^^(除力晶、UMC為竹科,其餘台中)
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All Comments
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